製程能力
Capability
雷射鑽孔 Laser Drilling
GSC Capability
←手機板請左右滑動表格觀看→
| Capability (製程能力) | |
| Base Information (材料、疊構) | |
| Layer count | 1L – 36L |
| Material supplier | EMC, TUC, Ventec, Nanya, Isola, Panasonic, Rogers |
| Material type | FR-4 Tg (130-180), HF, Polymind, Teflon |
| Board thickness | 5.0mm Max |
| Max. board size (2L) | 1200mm x 515mm |
| Max. board size (mility-layer) | 850mm x 570mm |
| Max. number of layer (build up) | 2+N+2 and M+N |
| Min. buried via for plugged | 0.15mm |
| Min. Dielectric thickness | 50um |
| Max. number of layer (build up) | 4 |
| Impedance Control (特性阻抗) | |
| Impedance Control (Single & Diff.) | +/- 5% ; 7% ; 10% |
| Mechanical Drill (機械鑽孔) | |
| Min. Drilled Hole Size | 0.10mm |
| Hole Aspect Ratio | 9:1 |
| Laser Drill (雷射燒孔) | |
| Laser Drill | 0.05mm – 0.3mm |
| Min. Dielectric thickness | 50um |
| Hole Aspect Ratio | ≤1 |
| Line Width / Spacing (線寬/間距) | |
| Inner Layer (內層) | |
| Min. width/spacing – 3oz | 6mil / 7mil |
| Min. width/spacing – 2oz | 5mil / 6mil |
| Min. width/spacing – 1oz | 3mil / 4mil |
| Min. width/spacing – Hoz | 3mil / 3mil |
| Outer Layer (外層) | |
| Min. width/spacing – 1oz | 4mil / 4mil (Hoz + Plated) |
| Min. width/spacing – 2oz | 6mil / 6mil (1oz + Plated) |
| Min. width/spacing – 3oz | 7mil / 7mil (2oz + Plated) |
| Min. width/spacing – 4oz | 8mil / 8mil (3oz + Plated) |
| Min. width/spacing – 5oz | 9mil / 9mil (4oz + Plated) |
| Solder Mask & Legend (防焊 & 文字) | |
| Min. Mask Clearance | 3mil |
| Min. Mask Dam | 3mil |
| Color | Green, Blue, Red, Black, White |
| Legend Color | White, Yellow, Black |
| Unique Fabrication (特殊製程) | |
| Back Drill | YES |
| Epoxy via plug | IR-6P |
| Copper via plug | YES |
| Blind routing | YES |
| Half hole | YES |
| Surface Finished (表面處理) | |
| ENIG | IPC-4552 (0.04um / 3~6um) |
| ENEPIG | YES |
| OSP | YES |
| Gold plating | YES |
| Imm. Silver / Imm. Tin | YES |
| LF HASL | YES |
Lead time
←手機板請左右滑動表格觀看→
| 類型 Type | 製作交期 (工作日) Process L/T (Working Days) |
| 2+N+2 | 24~28 |
| N+M | 24~28 |
| Epoxy via plug (樹塞) | +2 |
| Laser + Copper via plug (雷射+電鍍填孔) | +4 |
| SI Fixture +/-5% (I/L & O/L) | 5 weeks |
