製程能力

Capability

雷射鑽孔 Laser Drilling
GSC Capability
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 Capability (製程能力)
Base Information (材料、疊構)
Layer count1L – 36L
Material supplierEMC, TUC, Ventec, Nanya, Isola, Panasonic, Rogers
Material typeFR-4 Tg (130-180), HF, Polymind, Teflon
Board thickness5.0mm Max
Max. board size (2L)1200mm x 515mm
Max. board size (mility-layer)850mm x 570mm
Max. number of layer (build up)2+N+2 and M+N
 
Min. buried via for plugged0.15mm
Min. Dielectric thickness50um
Max. number of layer (build up)4
Impedance Control (特性阻抗)
Impedance Control (Single & Diff.)+/- 5% ; 7% ; 10%
Mechanical Drill (機械鑽孔)
Min. Drilled Hole Size0.10mm
Hole Aspect Ratio9:1
Laser Drill (雷射燒孔)
Laser Drill0.05mm – 0.3mm
Min. Dielectric thickness50um
Hole Aspect Ratio≤1
Line Width / Spacing (線寬/間距)
Inner Layer (內層)
Min. width/spacing  –  3oz6mil / 7mil
Min. width/spacing  –  2oz5mil / 6mil
Min. width/spacing  –  1oz3mil / 4mil
Min. width/spacing  –  Hoz3mil / 3mil
Outer Layer (外層)
Min. width/spacing  –  1oz4mil / 4mil (Hoz + Plated)
Min. width/spacing  –  2oz6mil / 6mil (1oz + Plated)
Min. width/spacing  –  3oz7mil / 7mil (2oz + Plated)
Min. width/spacing  –  4oz8mil / 8mil (3oz + Plated)
Min. width/spacing  –  5oz9mil / 9mil (4oz + Plated)
 
Solder Mask & Legend (防焊 & 文字)
Min. Mask Clearance3mil
Min. Mask Dam3mil
ColorGreen, Blue, Red, Black, White
Legend ColorWhite, Yellow, Black
Unique Fabrication (特殊製程)
Back DrillYES
Epoxy via plugIR-6P
Copper via plugYES
Blind routingYES
Half holeYES
Surface Finished (表面處理)
ENIGIPC-4552 (0.04um / 3~6um)
ENEPIGYES
OSPYES
Gold platingYES
Imm. Silver / Imm. TinYES
LF HASLYES
Lead time
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類型
Type
製作交期 (工作日)
Process L/T (Working Days)
2+N+224~28
N+M24~28
Epoxy via plug (樹塞)+2
Laser + Copper via plug (雷射+電鍍填孔)+4
SI Fixture +/-5% (I/L & O/L)5 weeks